Process Capability
- 分类：无分类内容
- 发布时间：2019-05-10 00:00:00
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详情
| imposition size | copper plating | |||
| Single panel | 250mm*600mm | Through hole | 0.1mm | |
| Double panel | 250mm*400mm | Thickness | 5um-20um | |
| Line width line spacing | Tool Accuracy | |||
| Single panel | 50um/50um | Punching | 0.03um | |
| Double panel | 50um/50um | Inter-layer misalignment | 0.05mm | |
| surface treatment | SMT | |||
| Electroplated nickel gold | Ni: 1-8um Au: 0.025-1.25um | Push and pull force | 1.0kgf | |
| Nickel gold | Ni: 1-8um Au: 0.025-0.1um | Minimum component | 0201 | |
| Electroplating tin | T=5-35um | Minimum pad | 0.3mm | |
| OSP | T=0.15-0.5um | Accuracy | ±0.05mm | |
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石家庄海天氨基酸有限公司
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